Laser scanning method for annealing glass flow and related...

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H01L 21/461 (2006.01) H01L 21/268 (2006.01) H01L 21/3105 (2006.01)

Patent

CA 1182931

LASER SCANNING METHOD FOR ANNEALING, GLASS FLOW AND RELATED PROCESSES Mike Delfino Tim Reifsteck ABSTRACT OF THE DISCLOSURE A method for scanning the top surface of a semi- conductor wafer prevents damage to the wafer (11) by ensuring that the laser beam (13) does not cross over the edge (11a) of the wafer during the scanning process nor approach within one (1) to two (2) millimeters to the edge of the wafer.

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