Laser shock peening tape, method and article

Details Laser shock peening tape, method and article Laser shock peening tape, method and article

C - Chemistry, Metallurgy

09

J

C09J 7/02 (2006.01) C21D 10/00 (2006.01)

Patent

CA 2356055

An ablative tape (59) is applied onto a substrate surface. The ablative tape (59) comprises an ablative medium (61) comprising a polymer (23) and dispersed metallic component (25). The tape is then irradiated to ablate the ablative medium (61). An article comprises a substrate and the ablative tape (59) applied to the substrate.

Un ruban ablatif (59) est appliqué sur une surface de substrat. Le ruban ablatif (59) comprend un milieu ablatif (61) comprenant un polymère (23) et un composant métallique dispersé (25). Le ruban est ensuite irradié pour enlever le milieu ablatif (61). Un article comprend un substrat et le ruban ablatif (59) appliqué sur le substrat.

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