Laser soldering apparatus

Details Laser soldering apparatus Laser soldering apparatus

B - Operations, Transporting

23

K

327/1.3

B23K 26/00 (2006.01) B23K 1/005 (2006.01) B23K 26/067 (2006.01) H05K 3/34 (2006.01)

Patent

CA 1123920

LASER SOLDERING APPARATUS Abstract of the Disclosure A laser soldering apparatus and method for soldering chip components to circuit modules. Optical means are provided to simultaneously focus coherent laser beams toward solder at opposing ends of a chip component. The energy thus provided reflows the solder and two joints are simultaneously formed when the solder cools.

331825

Affiliated with

Also associated with

Rating

Laser soldering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Laser soldering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laser soldering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1081514