Laser soldering system for smd-components

Details Laser soldering system for smd-components Laser soldering system for smd-components

B - Operations, Transporting

23

K

327/84, 327/1.3

B23K 26/04 (2006.01) B23K 1/005 (2006.01) B23K 26/03 (2006.01) B23K 26/067 (2006.01) B23K 26/12 (2006.01) B23K 26/18 (2006.01) H05K 13/04 (2006.01) H05K 3/34 (2006.01)

Patent

CA 2031392

ABSTRACT OF THE DISCLOSURE The invention relates to a CW-Nd:YAG Laser soldering system for SMD-components by means of which the soldering may be shortened by the simultaneous feeding of solder, multiple radiation, ER-absorber, flux or reaction gas, and an optimizing of the Z-adjustment of the laser spot or spots and the laser power per soldering point can be controlled. Embodiments are explained and are illustrated schematically in the figures of the drawing.

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