Laser system and method for processing a memory link with a...

H - Electricity – 01 – L

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Details

H01L 21/768 (2006.01) B23K 26/04 (2006.01) B23K 26/06 (2006.01) H01L 23/525 (2006.01)

Patent

CA 2395960

A burst of ultrashort laser pulses is employed to sever a conductive link (22) in a nonthermal manner and offers a wider processing window, eliminates undesirable HAZ effects, and achieves superior severed link quality. The duration of the burst is preferably in the range of 10 ns to 500 ns; and the pulse width of each laser pulse within the burst is generally shorter than 25 ps, preferablyshorter than or equal to 10 ps, and most preferably about 10 ps to 100 fs or shorter. The burst can be treated as a single "pulse" by conventional laser positioning systems (62) to perform on-the-fly link removal without stopping whenever the laser system (60) fires a burst of laser pulses at each link (22). Conventional wavelengths or their harmonics can be employed.

Dans cette invention, on utilise une rafale d'impulsions laser ultracourtes pour couper une liaison conductrice (22) par voie non thermique, offrant ainsi une fenêtre de traitement plus importante, supprimant les effets indésirables de la zone thermiquement affectée (HAZ), et assurant une qualité supérieure de liaison coupée. De préférence, la durée de la rafale se situe entre 10 ns et 500 ns; la largeur d'impulsion de chaque impulsion laser dans la rafale étant généralement inférieure à 25 ps, de préférence inférieure ou égale à 10 ps, et plus préférablement encore entre environ 10 ps et 100 ps maximum. La rafale peut être traitée comme une seule <= impulsion >= par des systèmes de positionnement laser (62) classiques pour supprimer une liaison à la volée sans marquer d'arrêt à chaque fois que le système laser (60) déclenche une rafale d'impulsions laser dans chaque liaison (22). En outre, on peut utiliser les longueurs d'ondes classiques ou leur harmoniques.

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