Laser welding components to an optical micro-bench

Details Laser welding components to an optical micro-bench Laser welding components to an optical micro-bench

H - Electricity

01

L

H01L 21/00 (2006.01) B23K 26/00 (2006.01) B23K 26/32 (2006.01) G02B 6/42 (2006.01) G02B 6/36 (2006.01) H01L 23/10 (2006.01)

Patent

CA 2371417

Many optical components now use a microelectronic substrate called an optical micro- bench as a base from which to build. Conventional devices use one or more methods of fixing the various elements together and/or onto the semiconductor micro-bench. Typically these conventional methods require special coatings to be deposited on the substrate, and the use of a separate bonding material, e.g. solder, glass or adhesive. The present invention relates to the direct fixation of a semiconductor, e.g. silicon, indium phosphide or gallium arsenide, structural component to the micro-bench made of a similar material using a laser welding technique, which uses wavelengths that are not harmful to the other elements of the component. The present invention eliminates the use of any separate bonding material, as well as several steps in the bonding process.

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