Layer cutting apparatus

Details Layer cutting apparatus Layer cutting apparatus

B - Operations, Transporting

26

D

B26D 1/547 (2006.01)

Patent

CA 2730815

A layer cutting apparatus includes a tray having an interior defined by a bottom and sidewall. A sleeve is at least partially disposed in the interior of the tray, and a cutting line is attached to the sleeve. The cutting line is configured to be removed from the sleeve by pulling the line away from the tray at one point of the sidewall. In one form, the sleeve has a length less than the peripheral length of the sidewall and includes first and second pivotally connected flaps. The cutting line abuts with the sidewall within the space between the first and second flaps. In preferred aspects, the sleeve is disposed in the interior of the tray after baking of a food product in the interior of the tray. In other preferred aspects, the sleeve includes tabs inserted into slits in the bottom of the tray to prevent the sleeve from floating in the tray.

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