Layered arrangements of lithium electrodes

H - Electricity – 01 – M

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H01M 4/04 (2006.01) H01M 4/02 (2006.01) H01M 4/40 (2006.01) H01M 4/66 (2006.01) H01M 6/40 (2006.01) H01M 10/40 (2006.01)

Patent

CA 2387796

A method employing a bonding layer (270) is used to form metal electrodes (264) with a barrier layer (268). The method involves fabricating a lithium, or other active material (272), electrode without depositing a barrier layer on the layer of active material. Rather a smooth barrier layer is formed on a smooth substrate (266) such as a polymeric electrolyte. A bonding layer is formed on the barrier layer and the bonding layer is then bonded to the active material.

L'invention concerne un procédé utilisant une couche de liaison (270) en vue de la formation d'électrodes métalliques (264) avec une couche barrière (268). Ce procédé consiste à fabriquer une électrode en lithium ou tout autre matériau actif (272), sans déposer de couche barrière sur la couche de matériau actif. On forme une couche barrière plutôt lisse sur un substrat lisse (266) tel qu'un électrolyte polymère. On forme une couche de liaison sur la couche barrière, la couche de liaison étant ensuite liée au matériau actif.

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