G - Physics – 02 – B
Patent
G - Physics
02
B
G02B 6/12 (2006.01) H05K 1/02 (2006.01) G02B 6/43 (2006.01)
Patent
CA 2431339
Compositions and methods are provided whereby printed wiring boards may be produced that comprise a) a substrate layer, and b) a solid, substantially planar optical wave-guide laminated onto the substrate layer. The printed wiring board further comprises at least one of a laminating material or a cladding material coupled to the wave-guide, and at least one additional layer coupled to the laminating material or the cladding material.
L'invention concerne des compositions et des procédés permettant de fabriquer des cartes imprimées, comprenant a) une couche de substrat, et b) un guide d'ondes optique solide sensiblement plan, lequel est laminé sur la couche de substrat. La carte imprimée comprend également au moins un matériau de laminage ou un matériau de gainage couplé au guide d'ondes, et au moins une couche supplémentaire couplée au matériau de laminage ou de gainage.
Gowling Lafleur Henderson Llp
Honeywell International Inc.
LandOfFree
Layered circuit boards and methods of production thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Layered circuit boards and methods of production thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Layered circuit boards and methods of production thereof will most certainly appreciate the feedback.
Profile ID: LFCA-PAI-O-1749025