Layered circuit boards and methods of production thereof

Details Layered circuit boards and methods of production thereof Layered circuit boards and methods of production thereof

G - Physics

02

B

G02B 6/12 (2006.01) G02B 6/032 (2006.01) G02B 6/122 (2006.01) H05K 1/02 (2006.01) G02B 6/43 (2006.01)

Patent

CA 2433612

Compositions and methods are provided whereby printed wiring boards may be produced that comprise a) a substrate layer, and b) a hollow, mirror-clad optical wave-guide laminated onto the substrate layer. The printed wiring board further comprises a cover material coupled to the wave-guide.

L'invention concerne des compositions et des procédés permettant de produire des cartes imprimées, comprenant a) une couche de substrat, et b) un guide d'ondes optique creux à revêtement miroir laminé sur la couche de substrat. La carte imprimée comprend également un matériau de couverture couplé au guide d'ondes.

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