Layered thick film resistors and method of producing the same

Details Layered thick film resistors and method of producing the same Layered thick film resistors and method of producing the same

H - Electricity

01

C

338/21

H01C 7/00 (2006.01) H01C 17/06 (2006.01)

Patent

CA 2018113

Abstract of the Disclosure Layered thick film resistors are formed by printing unitary resistor elements coextensively with dielectric platforms formed on a ceramic substrate. The use of a dielectric platform improves resistor geometry by raising the level of the printing surface above the nearby conductor lines and dielectric lines. The dielectric platform can be formed by various processes such as a thick film printing process, a green tape cofire process, or molding of the dielectric platform into the unfired ceramic substrate.

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