Laying device, contacting device, advancing system, laying...

B - Operations – Transporting – 23 – K

Patent

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Details

B23K 20/10 (2006.01) B23K 20/00 (2006.01) G06K 19/077 (2006.01) H05K 3/10 (2006.01)

Patent

CA 2585168

The invention relates to a laying device which is used to lay wire windings on transponder units, wherein the wire is guided in an axial manner in the laying device, a contacting device is used place the wires in contact with an automatic thermal clamping arrangement, an advancing system is used to advance machining devices by means of a piezo-leg-motor, a production system is used to produce transponder units in a console structural manner. The invention also relates to a method for the production of transponder units with horizontal ultrasonic introduction and a transponder unit wherein the wire ends engage directly on the ends of the connection surfaces of the chip.

L'invention concerne un dispositif de pose pour poser des enroulements de fils au niveau d'ensembles transpondeurs, le fil étant acheminé axialement dans le dispositif de pose, un dispositif d'établissement de contact servant à mettre en contact les fils avec un dispositif de serrage de thermode automatique, un système d'avance pour avancer des dispositifs de traitement au moyen d'un moteur à jambes piézoélectriques, une installation de production pour produire des ensembles transpondeurs selon une construction en console, un procédé de production d'ensembles transpondeurs avec une introduction horizontale des ultrasons, ainsi qu'un ensemble transpondeur dans lequel les extrémités des fils sont directement appliquées sur les plages de connexion des puces.

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