Lead alloy foil and lead laminated tape using the foil, both...

C - Chemistry – Metallurgy – 22 – C

Patent

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75/92, 154/126.4

C22C 11/10 (2006.01) B32B 15/08 (2006.01) C22C 11/08 (2006.01)

Patent

CA 1280299

ABSTRACT OF THE DISCLOSURE This invention provides a lead alloy foil comprising 1.0 to 4 wt% of tin, 2.0 to 7.0 wt% of antimony, and the balance being lead, wherein Sn/Sb ratio is 3 or less. It also provides a lead laminated tape for covering cables, comprising a lead alloy foil comprising 1.0 to 4 wt% of tin, 2.0 to 7.0 wt% of antimony, and the balances being lead, wherein Sn/Sb ratio is 3 or less, and an electrically conductive plastic film laminated at least one of the surfaces of the of the lead alloy foil and having a volume resistivity of 106 ?-cm or less.

506343

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