Lead- and antimony-free solder composition

Details Lead- and antimony-free solder composition Lead- and antimony-free solder composition

B - Operations, Transporting

23

K

148/60, 75/91

B23K 35/26 (2006.01) C22C 13/00 (2006.01)

Patent

CA 1299471

OATEY-37 Title: LEAD- AND ANTIMONY-FREE SOLDER COMPOSITION Abstract of the Disclosure Lead-free and antimony-free solder compositions are described which comprise, as essential ingredients, about 0.05% to about 3% by weight of silver; about 0.5% to about 6% by weight of copper; about 0.1% to about 3% by weight of bismuth; and about 88% to about 99.35% by weight of tin. In preferred embodiments, the solders are also essentially free of cadmium and may also be essentially free of both cadmium and zinc.

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