Lead bond structure

Details Lead bond structure Lead bond structure

H - Electricity

01

L

356/160, 356/173

H01L 21/58 (2006.01) B23K 1/20 (2006.01) B23K 35/00 (2006.01) H01L 21/60 (2006.01)

Patent

CA 1056514

Abstract of the Disclosure A bond between a refractory metal or semiconductor and a ductile metal and a method for making the same includes forming a layer of a refractory metal wetting agent such as titanium on the refractory metal before bonding to allow wetting of the refractory metal by the ductile metal.

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