Lead electrode structure having mesh surface

Details Lead electrode structure having mesh surface Lead electrode structure having mesh surface

C - Chemistry, Metallurgy

25

C

C25C 7/02 (2006.01) C25B 11/03 (2006.01)

Patent

CA 2311724

A compound electrode (1) incorporating a lead substrate utilizes the lead as a support structure (5). This support structure (5) provides a surface that engages a mesh member (2), e.g., a valve metal expanded metal mesh. The mesh member (2) has a front (6) and back surface with the back surface facing the lead support structure (5). At least the front surface (10) of the mesh member (2) is an active surface. Securing of the mesh member (2) to the lead support structure (5) in electrical connection permits the lead support structure (5) to serve as a current distributor for the mesh member (2). The mesh member (2) may engage the surface (6) of the lead support structure (5) as by pressing or rolling the mesh on to the lead. Other engagement means can include the use of fasteners, or welding and the like. The resulting structure can be particularly useful as an electrode (3) assembly for use in an electrolytic cell that serves for the electrowinning of a metal.

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