Lead frame

Details Lead frame Lead frame

H - Electricity

01

L

356/146

H01L 23/495 (2006.01) G02B 6/42 (2006.01)

Patent

CA 2037006

ABSTRACT OF THE DISCLOSURE A lead frame, used for constructing a multi-core optical module or the like, includes a frame portion, a plurality of a substrate portions on which electronic circuit elements are to be mounted, and a support portion for supporting the plurality of substrate portions to the frame portion. The support portion has a plurality of separated end portions connected to the respective substrate portions at the position where a molded resin member is covered, and at least two of the plurality of end portions are combined into one body to be connected to the frame portion at the position where the molded resin member is not covered. - 8 -

Affiliated with

Also associated with

Rating

Lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-2060248