Lead frame for a multiplicity of terminals

Details Lead frame for a multiplicity of terminals Lead frame for a multiplicity of terminals

H - Electricity

01

L

356/146

H01L 21/60 (2006.01) H01L 21/48 (2006.01) H01L 23/495 (2006.01) H01L 23/50 (2006.01)

Patent

CA 2000338

Abstract of the Disclosure A lead frame for a multiplicity of terminals, in particular of large-scale integrated semiconductor chips, arranged in a very confined space and consisting of metallic conductors which converge from large outer spacings toward the terminals and can be connected to the terminals. The lead frame allows a high number of terminals with a low degree of spacing of the conductors to be produced. The conductors are produced in the outer region by a conventional production method and at their ends pointing toward the terminals by laser cutting of a uniformly metallic material. -10-

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