Lead frame for integrated circuits

Details Lead frame for integrated circuits Lead frame for integrated circuits

H - Electricity

01

L

H01L 23/495 (2006.01)

Patent

CA 2118758

Lead frames fully plated with palladium which have an intermediate layer of nickel-phosphorus alloy or copper- tin alloy between the palladium and the base - consisting for example of copper - show good bondability and good solderability, both before and after aging, without pre- tinning.

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