Lead frames

Details Lead frames Lead frames

H - Electricity

05

K

356/9

H05K 1/18 (2006.01) H01L 23/047 (2006.01) H01L 23/495 (2006.01)

Patent

CA 1127319

9201 ABSTRACT A lead frame is capable of use with integrated circuit chips of different sizes and having different numbers of terminal areas, in that it comprises a centrally located support member, and a plurality of leads having inner end portions which are integral with the support member and having outer portions forming a radiating pattern relative to the support member, at least one of the leads being a composite lead comprising a trunk lead and branch leads extending from side edges of the trunk lead at spaced intervals and at increasing distances from the support member, whereby the lead frame can be used with a relatively small chip by removing the support member and connecting the leads, excluding the trunk lead, to the terminal areas of the chip, and the lead frame can be used with larger sizes of chips by removing the support member and a portion of the trunk lead adjacent to the support member whereby branch and other leads can be connected to terminal areas of the chip.

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