Lead-free conductor coverings

H - Electricity – 01 – B

Patent

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H01B 3/44 (2006.01) C08K 3/18 (2006.01) C08K 3/26 (2006.01) C08K 3/34 (2006.01) C08K 5/09 (2006.01) C08K 5/098 (2006.01) C08K 5/13 (2006.01) C08K 5/41 (2006.01) C08K 13/02 (2006.01) C08L 27/06 (2006.01)

Patent

CA 2135467

Lead-free thermoplastic polyvinyl chloride conductor coverings are disclosed which are free of lead and molecular sieve. The coverings comprise: 100 parts by weight polyvinyl chloride, from 5 to 100 parts by weight of plasticizer, from 3 to 50 weight parts of calcined clay and a stabilizer system consisting essentially of at least two different organometal salts, and from 0.5 to 10 weight parts of finely divided hydrotalcite having the formulae: [(M12+)y1 (M22+)y2] 1-x M x3+(OH)2 Ax/nn- mH2O (I) or Mg 1-x Alx (OH)2 Ax/n n- mH2O (II) or Mg 1-x Alx (OH)2+x mH2O (III) wherein M1 2+ represents at least one divalent metal cation, M2 2+ represents at least one divalent metal cation, M3+ represents a trivalent metal cation, An- represents at least one anion having a valency of n and x, y1, y2 and m are represented by the following expressions 0 < x ? 0.5, 0 < y1, 0 < y2, 0.5 ? (y1+y2) < 1, and 0 ? m < 2; or a product resulting from surface treatment of I, II, or III with an anionic surface active agent.

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