Lead free desoldering braid

Details Lead free desoldering braid Lead free desoldering braid

B - Operations, Transporting

23

K

B23K 1/018 (2006.01) B23K 3/08 (2006.01) D04C 1/06 (2006.01)

Patent

CA 2595516

A braid for desoldering a printed circuit board or electrical component having a lead-free solder formed from a plurality of solid metal strands bundled together to form a bundle in which a plurality of bundles are braided with one another to form a braid. The braid is formed having a single ply and is configured for desoldering the printed circuit board or electrical component having a lead-free solder having a melting point temperature in excess of 183 0C (about 361~F).

L'invention concerne une tresse destinée à dessouder une carte de circuit imprimé ou un composant électrique comprenant une soudure sans plomb, formée d'une pluralité de fils métalliques solides réunis en un faisceau dans lequel une pluralité de faisceaux sont tressés les uns avec les autres de manière à former une tresse. La tresse est d'une seule épaisseur et est configurée pour dessouder la carte de circuit imprimé ou le compsoant électrique comprenant une soudure sans plomb avec une température de point de fusion dépassant 183°C (environ 361°F).

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