Lead-free, high-strength, high-lubricity copper alloys

Details Lead-free, high-strength, high-lubricity copper alloys Lead-free, high-strength, high-lubricity copper alloys

C - Chemistry, Metallurgy

22

C

C22C 9/00 (2006.01)

Patent

CA 2753515

A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt.% or 0.10 wt. % lead.

La présente invention a pour objet un alliage de cuivre sans plomb comprenant, en combinaison en poids, d'environ 10,0 % à environ 20,0 % de bismuth, d'environ 0,05 % à environ 0,3 % de phosphore, d'environ 2,2 % à environ 10,0 % d'étain, jusqu'à environ 5,0 % d'antimoine, et jusqu'à environ 0,02 % de bore, le reste étant essentiellement constitué de cuivre et d'éléments et d'impuretés accidentels. L'alliage ne contient pas plus d'environ 0,05 % en poids ou d'environ 0,10 % en poids de plomb.

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