Lead-free solder

Details Lead-free solder Lead-free solder

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) C22C 13/00 (2006.01) C22C 13/02 (2006.01)

Patent

CA 2340393

A lead-free solder which comprises substantially Sn and Ti and has a liquidus line temperature of 400~C or lower. The solder is free of lead which is a hazardous substance and also exhibits a satisfactory bonding strength toward an oxide material such as glass or ceramics.

L'invention concerne une soudure sans plomb contenant principalement du Sn et du Ti et ayant une température de ligne liquide de 400 ·C ou moins. Cette soudure ne contient pas de plomb et n'est donc pas exposée aux dangers inhérents à la présence de ladite substance. Elle présente une adhérence satisfaisante sur les matériaux à base d'oxydes, tels que le verre ou la céramique.

Affiliated with

Also associated with

Rating

Lead-free solder does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead-free solder, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead-free solder will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1447480