Lead-free solder

Details Lead-free solder Lead-free solder

C - Chemistry, Metallurgy

22

C

C22C 13/02 (2006.01) B23K 35/26 (2006.01)

Patent

CA 2286810

A solder composition comprising: 15.0 to 30.0 % bismuth; 1.0 to 3.0 % silver, and optionally comprising 0 to 2.0 % copper and 0 to 4.0 % antimony and incidental impurities, the balance being tin.

L'invention concerne une composition de soudure. Cette composition comprend 15,0 à 30,0 % de bismuth, 1,0 à 3,0 % d'argent, et comprenant éventuellement 0 à 2,0 % de cuivre ainsi que 0 à 4,0 % d'antimoine et d'impuretés, le tout formant de l'étain.

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