Lead-free solder alloy

B - Operations – Transporting – 23 – K

Patent

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B23K 35/26 (2006.01) C22C 13/02 (2006.01)

Patent

CA 2131256

-17- Abstract A non-toxic alloy for soldering electronic components comprising 90% Sn, 5% In, and 5% Ag. The disclosed alloy has a fine microstructure. Particles of intermetallic compounds are finely dispersed throughout the matrix, thereby inhibiting grain growth. Accordingly, the alloy does not significantly coarsen after thermal aging.

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