Lead free solder alloy

Details Lead free solder alloy Lead free solder alloy

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) C22C 13/00 (2006.01)

Patent

CA 2288817

A lead-free solder which is comprised of three elements Sn-Cu-Ni. Cu and Ni are 0.1 - 2 wt% and 0.002 - 1 wt% respectively. Preferable weight percentage of Cu and Ni are 0.3 to 0.7 percent and 0.04 to 0.1 percent respectively. Both methods of additive Ni to a base alloy of Sn-Cu and additive Cu to a base alloy of Sn-Ni are applicable.

L'invention porte sur une soudure ternaire sans plomb comportant: 1-2 % en poids de Cu; 0,002-2 % de Ni, et le reliquat de Sn. Les teneurs en Cu et Ni sont respectivement de préférence de 0,3-0,7 % en poids, et de 0,04-0,1 % en poids, et sur un procédé associé d'adjonction de Ni à un alliage de Sn-Cu.

Affiliated with

Also associated with

Rating

Lead free solder alloy does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lead free solder alloy, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lead free solder alloy will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1750073