Lead straightening of leaded packaged electronic components

Details Lead straightening of leaded packaged electronic components Lead straightening of leaded packaged electronic components

B - Operations, Transporting

21

F

356/146, 356/172

B21F 1/02 (2006.01) H05K 13/00 (2006.01)

Patent

CA 1263897

LEAD STRAIGHTENING FOR LEADED PACKAGED ELECTRONIC COMPONENTS Abstract of the Disclosure Leads of a leaded component are straightened by bending the leads outward past the yield point of the lead material, and then bending the leads inward past the yield. In a particular arrangement, a component rests with the lower or outer ends of the leads in transverse grooves in sliding members. The sliding members are moved outward, bending the leads outward. The component is then pushed up between comb members having inner end surfaces with ribs and grooves. The leads move up in the grooves and are bent inward.

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