Leadframe adapted to support semiconductor elements and...

Details Leadframe adapted to support semiconductor elements and... Leadframe adapted to support semiconductor elements and...

H - Electricity

01

L

H01L 23/495 (2006.01) H01L 23/50 (2006.01) H05K 1/18 (2006.01)

Patent

CA 2051924

ABSTRACT OF THE DISCLOSURE In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.

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