Leadless chip placement machine for printed circuit boards

Details Leadless chip placement machine for printed circuit boards Leadless chip placement machine for printed circuit boards

H - Electricity

05

K

356/194, 356/22

H05K 13/04 (2006.01) H05K 13/08 (2006.01)

Patent

CA 1177974

ABSTRACT OF THE DISCLOSURE Described is a machine for pre-gluing raw circuit surfaces of printed circuit boards (P.C. boards) at an adhesive station and properly positioning the P.C. boards at a placement station for placament of leadless electronic components (chips) onto the adhesive. A carousel provides program preselected vertical supply of taped components to a feeder assembly which feeds individual chips onto a nozzle of a turret-type vacuum head at a pick-up station. The turret-type head has four nozzles spaced 90° apart about the central axis of the head. As the tur- ret is rotated, a chip is transported by a nozzle, sequentially, from the pick-up station to a centering and testing station, centering and orienting station, and a placement station. Lo- cated between the testing and orienting stations is a chip re- moval station for ejecting defective or inverted chips. Sensors are located at the adhesive and placement stations to detect de- fective P.C. boards so that they may be bypassed. A controller, such as a digital computer, provides additional monitoring and controls the operation of the machine.

392219

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