Leadless component socket

H - Electricity – 01 – R

Patent

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Details

339/10.6

H01R 13/24 (2006.01) H05K 7/10 (2006.01)

Patent

CA 1294679

A B S T R A C T A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier.

581825

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