H - Electricity – 01 – R
Patent
H - Electricity
01
R
339/10.6
H01R 13/24 (2006.01) H05K 7/10 (2006.01)
Patent
CA 1294679
A B S T R A C T A leadless component socket comprises a socket body of electrically insulative material and planar, substantially parallel, top and bottom surfaces, and a plurality of openings between the surfaces in an array to provide an intended contact pattern. A two-piece spring contact assembly is retained in respective openings, with one element retained within the opening and having an outwardly extending lead for soldering or other connection to a circuit board on which the socket is mounted, and the other element extending above the upper socket surface in a position to engage the confronting terminals of a leadless component or device, such as a leadless chip carrier.
581825
Bertoglio Guido
Boyle Michael C.
Cooney James S.
Walkup William B.
Augat Inc.
Malcolm Johnston & Associates
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