Leadless pad array chip carrier

Details Leadless pad array chip carrier Leadless pad array chip carrier

H - Electricity

01

L

H01L 23/12 (2006.01) H01L 21/60 (2006.01) H01L 23/02 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01) H01L 23/498 (2006.01) H01L 23/50 (2006.01)

Patent

CA 2095609

A leadless pad array chip carrier package is disclosed, employing a printed circuit board (22) having an array of solder pads (34) on the bottom side. A semiconductor device (24) is electrically wire bonded (49) and attached with conductive adhesive (47) to the metallization patterns (43, 45) of the printed circuit board (22). A protective plastic cover (26) is transfer molded about the semiconductor device (24) covering substantially all of the top side of the printed circuit board (22).

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