Leadless solder

Details Leadless solder Leadless solder

B - Operations, Transporting

23

K

B23K 35/26 (2006.01) B23K 35/28 (2006.01)

Patent

CA 2332587

A leadless solder, characterized as containing Sn and Zn, and further containing 0.001 to 3.0 wt.% of Ti. The solder is free of hazardous lead and exhibits satisfactory bonding strength to oxide materials such as glass, ceramics and the like.

L'invention porte sur un soudure sans plomb contenant du Sn et du Zn, avec de plus de 0,001 à 3 % en poids de Ti. Cette soudure, exempte des dangers inhérents à la présence de plomb, présente une adhérence satisfaisante sur les matériaux à base d'oxydes, tels que le verre, la céramique et analogues.

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