'led' assembly and method of manufacture

Details 'led' assembly and method of manufacture 'led' assembly and method of manufacture

H - Electricity

01

L

345/50

H01L 31/02 (2006.01) H01L 25/13 (2006.01) H01L 31/18 (2006.01) H01L 33/00 (2006.01) H05K 3/30 (2006.01)

Patent

CA 1132694

9091 CAN ABSTRACT Contact springs are stamped from flat sheet metal in strip form and are bent up to face lengthwise of a carrier strip portion. Two strip portions are positioned with respective contact springs facing in pairs, the carrier strip portions being adjusted in relative lengthwise position to control the relative position of the facing spring portions and ensure a gap less than that of an LED to be gripped. Facing spring portions are biased apart to receive and grip an LED which is suitably then flow soldered to the springs before encapsulating the LED and portions of the springs in a light transmitting material, and severing carrier strip portions from the contacts.

321595

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