Led lighting with integrated heat sink and process for...

H - Electricity – 05 – K

Patent

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H05K 3/00 (2006.01) B60Q 1/06 (2006.01) B60Q 1/26 (2006.01) H01G 5/12 (2006.01) H01G 5/14 (2006.01) H01L 29/18 (2006.01) H01L 29/22 (2006.01) H01R 9/00 (2006.01) H05K 3/02 (2006.01) H05K 3/06 (2006.01) H05K 3/10 (2006.01) H05K 3/34 (2006.01) H05K 7/14 (2006.01) H05K 7/18 (2006.01) H01L 33/00 (2006.01)

Patent

CA 2622775

A method for manufacturing an LED lamp assembly includes anodizing at least a portion of a surface of an electrically and thermally conductive base, such as an aluminum or aluminum alloy base, so as to form an electrically insulating coating. The base may form a heat sink or be coupled to a heat sink. Circuit traces are formed on the anodized surface of the base, which include LED landings. LEDs are electrically and mechanically attached to the LED landing by means of conductive metallic solder such that heat generated from the LED is transferred efficiently through the solder and circuit traces LED landings to the base and heat sink through a metal-to-metal contact pathway.

L'invention concerne un procédé destiné à la fabrication d'une lampe à DEL, consistant à anodiser au moins une partie d'une surface d'une base électro- ou thermoconductrice, telle qu'une base en aluminium ou en alliage d'aluminium, de manière à former un revêtement diélectrique. Cette base peut former un puits thermique ou être couplée à un puits thermique. Des tracés de circuits sont formés sur la surface anodisée de la base, comportant des éléments de connexion de DEL. Des DEL sont fixées par voie électrique et mécanique aux éléments de connexion de DEL à l'aide de brasures métalliques conductrices, afin que la chaleur générée par les DEL soit transférée rapidement par les brasures et les tracés des circuits des éléments de connexion de DEL vers la base et le puits de chaleur par un circuit de contact métal à métal.

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