Led package die having a small footprint

Details Led package die having a small footprint Led package die having a small footprint

H - Electricity

01

L

H01L 25/075 (2006.01) H01L 33/00 (2006.01) F21K 7/00 (2006.01)

Patent

CA 2508121

A light emitting die package (10) and a method of making the light emitting die package (10) are disclosed. The die package (10) includes a stem substrate (20) having grooves (26), a wire lead (30) attached to the grooves (26), and a light emitting diode (LED) (50) mounted on the stem substrate (50). Also coupled to the substrate (20) are a sleeve (40), a reflector (60), and a lens (70). To make the light emitting die package (10), a long substrate is formed and wire leads (30) attached to the substrate. Then, the substrate including the attached wire leads is cut to predetermine lengths to form individual stem substrates (20). To each stem substrate (20), LED (50), reflector (60), and lens (70) are coupled.

La présente invention concerne un boîtier (10) de dé électroluminescent et un procédé de fabrication de ce boîtier (10) de dé électroluminescent. Ce boîtier de dé (10) comprend un substrat tige (20) possédant des encoches (26), un fil (30) fixé à ces encoches (26) et , une diode électroluminescente (DEL) (50) montée sur le substrat tige (50). Sont reliés également à ce substrat, un manchon (40), un réflecteur (60) et une lentille (70). Pour fabriquer ce boîtier de dé électroluminescent, on forme un long substrat et des fils (30) sont fixés à ce substrat. Puis, on coupe le substrat comprenant les fils fixés à des longueurs prédéterminées pour former des substrats tige individuels (20). On relie une DEL (50), un réflecteur (60) et une lentille (70) à chaque substrat tige (20).

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