Led packaging method and packaged led

Details Led packaging method and packaged led Led packaging method and packaged led

H - Electricity

01

L

H01L 33/48 (2010.01) H01L 33/62 (2010.01)

Patent

CA 2634288

An LED packaging method, including: forming an electrically and thermally conductive receptacle having a substantially planar base and a substantially planar peripheral region; forming an electrical insulator on the peripheral region; forming an electrically conductive material on the electrical insulator; mounting a semiconductor die directly to the base within the receptacle, the die incorporating at least one light emitting diode (LED); and forming one or more electrical connections between the electrical electrically conductive material and one or more electrical contacts of the die to provide a packaged LED.

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