Led with light transmissive heat sink

Details Led with light transmissive heat sink Led with light transmissive heat sink

H - Electricity

01

L

H01L 33/64 (2010.01) H01L 33/58 (2010.01)

Patent

CA 2624507

An more efficient or higher luminance LED assembly may be formed from a high power LED chip having a first surface, and a second surface, the first surface being mounted to a substrate; the second surface being in intimate thermal contact with a light transmissive heat sink having a thermal conductivity greater than 30 watts per meter-Kelvin. The LED chip is otherwise in electrical contact with at least a first electrical connection and a second electrical connection for powering the LED chip. Providing light transmissive heat sink can double the heat conduction from the LED dies thereby increasing life, or efficiency or luminance or a balance of the three.

L~invention permet d~obtenir un ensemble DEL plus efficace ou de luminance supérieur à partir d'une puce DEL à haute puissance comportant une première surface et une seconde surface, la première surface étant montée sur un substrat ; la seconde surface étant en contact thermique intime avec un dissipateur thermique transmetteur de lumière dont la conductivité thermique est supérieure à 30 watts par mètre-Kelvin. La puce DEL est d~autre part en contact électrique avec au moins une première connexion électrique et une seconde connexion électrique servant à alimenter la puce DEL en énergie. La présence du dissipateur thermique transmetteur de lumière peut doubler la conduction électrique des puces DEL, ce qui augmente leur durée de vie, ou leur efficacité, ou leur luminance, ou les trois à la fois.

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