Light emitting devices with self aligned ohmic contact and...

H - Electricity – 01 – L

Patent

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Details

H01L 33/02 (2010.01) H01L 33/32 (2010.01)

Patent

CA 2545163

Methods of fabricating light emitting diodes and light emitting devices are provided that include a substrate, an n-type epitaxial region on the substrate and a p-type epitaxial region on the n-type epitaxial region. At least a portion of the p-type epitaxial region comprises a mesa with respect to the substrate. An ohmic contact is provided on an exposed portion of the p-type epitaxial layer. The ohmic contact is self aligned to a sidewall of the mesa and to the p-type epitaxial layer such that a sidewall of the ohmic contact is substantially aligned with a sidewall of the mesa and to the p-type epitaxial layer.

La présente invention concerne des procédés de fabrication de diodes électroluminescentes et de dispositifs électroluminescents qui comprenne un substrat, une région épitaxiale de type n sur le substrat et une région épitaxiale de type p sur la région de type n. Au moins une partie de la région épitaxiale de type p comprend un mesa par rapport au substrat. Un contact ohmique est prévu sur une partie exposée de la couche épitaxiale de type n. Ce contact ohmique est auto-aligné avec une paroi latérale du mesa et avec la couche épitaxiale de type p de sorte qu'une paroi latérale du contact ohmique soit sensiblement alignée avec une paroi latérale du mesa et avec la couche épitaxiale de type p.

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