Light-emitting diode and led light source

Details Light-emitting diode and led light source Light-emitting diode and led light source

H - Electricity

01

L

H01L 33/48 (2010.01) H01L 33/62 (2010.01) H01L 33/64 (2010.01)

Patent

CA 2553921

An LED die (3) is arranged on a LED printed circuit board (PCB) (6) by means of an adhesive (4). The LED-PCB (6) comprises rear-sided contacts (7) which are arranged on the opposite side of the LED die (3). As a result an independent LED-lamp is formed which, for example, can be disposed on a printed circuit board (9) using surface mount technology and/or can be introduced into the base of a lamp. According to the invention, the rear-sided contacts (7) cover at least half of the surface, preferably the entire surface of the LED PCB (6), apart from necessary exceptions. The heat can also be dispersed with minimal thermal resistance. Preferably, a cooling body (11) is arranged on the rear side of the circuit board (9). In this case, it is useful for the circuit board (9) to comprises through-contacts in order to increase thermal conductivity.

Puce de DEL (3) placée sur une carte à circuit imprimé (6) de DEL à l'aide de colle (4). La carte à circuit imprimé (6) de DEL possède sur sa face opposée à la puce (3) de DEL des contacts (7) de face arrière. Cette configuration permet d'obtenir une lampe à DEL autonome qui peut être par exemple déposée par montage en surface sur une carte-mère (9) ou introduite dans un culot de lampe. Selon la présente invention, les contacts (7) de face arrière couvrent au moins la moitié de la surface et de préférence, à par les exceptions nécessaires, l'ensemble de la surface de la carte à circuit imprimé (6) de DEL. La chaleur peut ainsi être dissipée avec une résistance thermique minime. De préférence, un corps de refroidissement (11) est placé sur la face arrière de la carte-mère (9). Dans ce cas, il est opportun que la carte-mère (9) comporte des trous métallisés destinés à augmenter la conductivité thermique.

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