C - Chemistry – Metallurgy – 08 – J
Patent
C - Chemistry, Metallurgy
08
J
C08J 9/32 (2006.01) C04B 12/04 (2006.01) C04B 16/08 (2006.01) C04B 26/04 (2006.01) C08K 3/26 (2006.01)
Patent
CA 2396125
The joint compound of the present invention utilizes hollow resin microspheres with a mean particle size less than 75 microns and exhibiting no more than 1.5 % increase in density under high shear stress testing.
La pâte à joints de cette invention met en oeuvre des microsphères de résine creuses possédant une taille de particule moyenne inférieure à 75 microns et présentant une augmentation de densité d'au maximum 1,5 % dans des conditions de test de contrainte de cisaillement élevée.
Cimaglio Scott A.
Immordino Salvatore C. Jr.
Miller Charles J.
Pickles David Martin
Company United States Gypsum
Mccarthy Tetrault Llp
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