Lightweight thermally responsive mold for resin transfer...

Details Lightweight thermally responsive mold for resin transfer... Lightweight thermally responsive mold for resin transfer...

B - Operations, Transporting

29

C

B29C 70/48 (2006.01) B29C 33/30 (2006.01) B29C 33/56 (2006.01) B29C 45/02 (2006.01)

Patent

CA 2197507

A lightweight thermally responsive mold for use with a resin transfer molding process is provided. The mold includes first and second support frames including a plurality of upstanding intersecting support ribs. First and second substrates are supported by the first and second support frames, respectively, for carrying heating tubes therein. First and second hard shells are supported by the first and second substrates, respectively. The shells cooperate to form a mold cavity therebetween. Each shell is less than approximately 10 mm thick in order to provide a low thermal mass and high thermal responsiveness.

La présente invention concerne un moule léger pour procédé de moulage par transfert de résine, constitué d'un premier et d'un deuxième cadres supports comportant plusieurs nervures de support. Un premier et un deuxième substrats sont supportés respectivement par le premier et le deuxième cadres supports pour la mise en place de tubes de chauffage. Une première et une deuxième coquilles rigides sont supportées respectivement par le premier et le deuxième substrats. Les deux coquilles définissent entre elles une cavité. Chacune des coquilles présente une épaisseur inférieure à 10 mm environ, de manière qu'elles offrent une masse thermique faible et une réponse thermique élevée.

Affiliated with

Also associated with

Rating

Lightweight thermally responsive mold for resin transfer... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Lightweight thermally responsive mold for resin transfer..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Lightweight thermally responsive mold for resin transfer... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFCA-PAI-O-1516643