Lignin modified phenol-formaldehyde resins

Details Lignin modified phenol-formaldehyde resins Lignin modified phenol-formaldehyde resins

C - Chemistry, Metallurgy

08

L

C08L 97/00 (2006.01) C08H 7/00 (2011.01) C08G 8/38 (2006.01) C08L 61/00 (2006.01) C08L 61/10 (2006.01) C08L 97/02 (2006.01) C09D 161/00 (2006.01) C09J 161/10 (2006.01) C09J 197/00 (2006.01)

Patent

CA 2081495

A modified resole resin and an adhesive composition containing the resin wherein the resin is prepared by first reacting formaldehyde and a phenol at a mole ratio of formaldehyde to phenol of less than about 1.0 in the presence of alkaline in an amount sufficient to provide a mole ratio of said alkaline material to phenol between about 0.04 and 0.08 to form a precursor resin; reacting the precursor resin with lignin to form a lignin-modified phenol-formaldehyde precursor resin, and then reacting the lignin-modified phenol-formaldehyde precursor with additional formaldehyde sufficient to provide a cumulative formaldehyde to phenol mole ratio of between about 2.0 and about 3Ø The adhesive composition is useful in bonding wood chips, veneers and sheets of plywood.

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