C - Chemistry – Metallurgy – 07 – D
Patent
C - Chemistry, Metallurgy
07
D
C07D 339/04 (2006.01) C07H 15/04 (2006.01)
Patent
CA 2559962
The present invention provides a novel linker compound which minimizes any nonspecific hydrophobic interactions and is capable of easily adjusting the length to a disulfide group subjected to metal bond to thereby enable effective formation of a metal-sulfur bond; novel ligand conjugate and ligand carrier, and a process for producing them. The linker compound is of a structure represented by the following general formula (1) (see formula 1) where a, b, d, e are independently an integer of 0 to 6. X has a structure serving as a multi-branched structure moiety including three or more hydrocarbon derivative chains, wherein the hydrocarbon derivative chains each include an aromatic amino group at an end thereof, and may or may not include a carbon-nitrogen bond in a main chain thereof. The ligand conjugate includes the linker compound having a sugar molecule introduced therein.
Nouveau composé lieur qui minimise toutes les interactions hydrophobes non spécifiques et qui est capable de réguler aisément la longueur d'un groupe disulfure soumis à une liaison métallique pour ainsi permettre une formation suffisante d'une liaison métal-soufre ; nouveau complexe ligand ou substance porteuse de ligand ; et procédé pour leur fabrication. Il est proposé un composé lieur comprenant la structure de formule générale: (1) (dans laquelle chacun parmi a, b, d et e est indépendamment un entier de 0 à 6). Le X ci-dessus à l'extrémité moléculaire a un groupe amino aromatique et au niveau de sa chaîne principale a une structure de site structurel multibranche composé de 3 chaînes hydrocarbonées ou plus ayant éventuellement des liaisons carbone-azote. Le complexe ligand se compose du composé lieur ci-dessus dans lequel on a introduit une molécule de sucre.
Arano Akio
Kusumoto Shoichi
Sobel Michael
Suda Yasuo
Wakao Masahiro
G. Ronald Bell & Associates
Japan Science And Technology Agency
National University Corporation Kagoshima University
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