Liquid cooled heat sink for cooling electronic components

Details Liquid cooled heat sink for cooling electronic components Liquid cooled heat sink for cooling electronic components

F - Mech Eng,Light,Heat,Weapons

28

F

F28F 3/12 (2006.01) F28F 1/04 (2006.01) F28F 1/22 (2006.01) H01L 23/473 (2006.01)

Patent

CA 2235620

A liquid cooled heat sink (100) for cooling heat generating components (112). The heat sink (100) has a base member (102) with open ended channels (104, 106) formed in at least one surface (118) thereof. The open ends (107) of the channels (104, 106) have a span (SU) less than a span (SL) across a lower portion of the channels (104, 106). A fluid conduit (114, 116) has an outer span (SL) greater than the span (SU) across the open ends (107) of the channels (104, 106) and a flattened surface (110) which is substantially coplanar with the surface (118) of the heat sink base member (102) having the channels (104, 106) therein.

Cette invention concerne un dissipateur de chaleur (100) à refroidissement par liquide qui permet de refroidir des composants électroniques (112). Ce dissipateur de chaleur (100) comporte un élément de base (102) dont une surface (118) au moins est dotée de gorges (104, 106) à extrémités ouvertes. Ces extrémités ouvertes (107) des gorges (104, 106) ont un empattement (SU) inférieur à l'empattement (SL) correspondant à la partie inférieure des gorges (104, 106). Une conduite (114, 116) destinée au fluide possède un empattement (SL) supérieur à celui qui existe au niveau des extrémités ouvertes (107) des gorges (104, 106) ainsi qu'une surface aplatie (110) qui est sensiblement coplanaire avec la surface (118) de l'élément de base du dissipateur de chaleur (102) à l'intérieur duquel sont formées les gorges (104, 106).

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