Liquid-cooling module system for electronic circuit components

Details Liquid-cooling module system for electronic circuit components Liquid-cooling module system for electronic circuit components

H - Electricity

05

K

356/3

H05K 1/02 (2006.01) H01L 23/433 (2006.01) H01L 23/473 (2006.01) H05K 7/20 (2006.01)

Patent

CA 1227886

LIQUID-COOLING MODULE SYSTEM FOR ELECTRONIC CIRCUIT COMPONENTS ABSTRACT OF THE DISCLOSURE A printed circuit board assembly having a printed circuit board mounting, on both faces, heat generative electronic circuit components, such as integrated circuit chips, and a pair of liquid-cooling modules arranged on both sides of the printed circuit board. Each of the liquid-cooling modules is provided with a liquid cooling plate having liquid coolant supply heads and a plurality of resilient heat transfer units held by the liquid-cooling plate and arranged in compression contact with the electronic circuit components on both faces of the printed circuit board.

472335

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