Liquid cooling system for integrated circuits

Details Liquid cooling system for integrated circuits Liquid cooling system for integrated circuits

H - Electricity

01

L

356/110

H01L 23/34 (2006.01)

Patent

CA 1303249

ABSTRACT OF THE DISCLOSURE LIQUID COOLING SYSTEM FOR INTEGRATED CIRCUITS A leak tolerant cooling system for cooling electrical components with a liquid comprises: a frame 10 holding a plurality of printed circuit boards 11, each of which have electrical components attached thereto; a top reservoir 14, mounted on the frame 10 above the boards, for holding the liquid at atmospheric pressure; a conduit (17a-17g) coupled to the top reservoir and the boards, for conveying the liquid in a downward direction from the top reservoir over the components, the conduit being airtight in the absence of a leak therein; a bottom reservoir 15, coupled to the conduit below the boards, for receiving the liquid plus any air due to leaks from the conduit, the bottom reservoir being airtight except for a valve 16 which opens in response to a valve control signal S2; a pump 19, coupled to the bottom reservoir, for sucking the liquid and air through the conduit at subatmospheric pressures in response to a pump control signal S1, and for simultaneously returning the liquid to the top reservoir; and a control circuit 25 for generating the pump control signal starting when the liquid in the bottom reservoir is at a predetermined high level and continuing until the liquid in the bottom reservoir drops to a predetermined low level due to air leaking into the conduit, and for generating the valve control signal as the complement of the pump control signal.

615761

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