H - Electricity – 01 – L
Patent
H - Electricity
01
L
356/112
H01L 23/34 (2006.01) H01L 23/427 (2006.01) H01L 23/44 (2006.01) H01L 23/66 (2006.01)
Patent
CA 1230184
LIQUID COOLING TYPE HIGH FREQUENCY SOLID STATE DEVICE ABSTRACT OF THE DISCLOSURE A liquid cooling type high frequency solid state device comprising: a solid state chip; at least one matching circuit connected to the solid state chip; a carrier for mounting the solid state chip and the matching circuit, constituting a solid state device to be cooled; a coolant vessel for containing a liquid coolant, remaining a space for coolant vapor at the top thereof; and, a means for condensing the coolant vapor contained in the top space of the vessel. At least a part of the solid state device contacts with the liquid coolant for boiling and evaporating the coolant. An arrangement for preventing amplitude modulation of the solid state device due to the boiling of the coolant is made.
468677
Kaneko Yoshiaki
Okubo Naofumi
Saito Toshiyuki
Tokumitsu Yasuyuki
Fujitsu Limited
Mcfadden Fincham
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