Liquid encapsulating resin composition, semiconductor device...

Details Liquid encapsulating resin composition, semiconductor device... Liquid encapsulating resin composition, semiconductor device...

C - Chemistry, Metallurgy

08

L

C08L 63/00 (2006.01) C08G 59/02 (2006.01) H01L 21/60 (2006.01) H01L 23/29 (2006.01) H01L 23/31 (2006.01)

Patent

CA 2757760

Disclosed is a liquid encapsulating resin composition containing an epoxy resin (A), an amine type curing agent (B), and a basic compound (C), wherein, in case that the liquid encapsulating resin composition is filled between a semiconductor element and a substrate connected to each other by solder bumps, the residue of a fluxing agent used for forming the solder bump connection is removed.

L'invention porte sur une composition de résine d'étanchéité liquide contenant (A) une résine époxy, (B) un agent de durcissement à base d'amine et (C) un composé basique. Selon l'invention, lorsque la composition de résine d'étanchéité liquide est introduite entre un élément semi-conducteur et un substrat connectés l'un à l'autre par des bossages de soudure, le résidu d'un agent fondant utilisé lors de la connexion de l'élément semi-conducteur et du substrat par des bossages de soudure est éliminé.

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