Liquid etching reactor and method

Details Liquid etching reactor and method Liquid etching reactor and method

C - Chemistry, Metallurgy

23

F

149/4

C23F 1/08 (2006.01) C23F 1/46 (2006.01) H05K 3/06 (2006.01)

Patent

CA 1209885

ABSTRACT OF THE DISCLOSURE Reactor and method for removing a material such as copper from a substrate such as a printed circuit board, util- izing a liquid etchant. The work to be etched is placed in a narrow channel, and the etchant is pumped rapidly across the surface of the work at a rate such that the composition of the etchant does not change significantly from one side of the work to the other.

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